The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Aug. 13, 2012
Wei-chou Lan, Hsinchu, TW;
Ted-hong Shinn, Hsinchu, TW;
Henry Wang, Hsinchu, TW;
Chia-chun Yeh, Hsinchu, TW;
Wei-Chou Lan, Hsinchu, TW;
Ted-Hong Shinn, Hsinchu, TW;
Henry Wang, Hsinchu, TW;
Chia-Chun Yeh, Hsinchu, TW;
E Ink Holdings Inc., Hsinchu, TW;
Abstract
A three-dimension circuit structure includes a substrate, a first conductive layer, a filled material and a second conductive layer. The substrate has an upper surface and a cavity located at the upper surface. The first conductive layer covers the inside walls of the cavity and protrudes out the upper surface. The filled material fills the cavity and covers the first conductive layer. The second conductive layer covers the filled material and a portion of the first conductive layer, and the first conductive layer and the second conductive layer encapsulate the filled material. The material of the filled material is different from that of the first conductive layer and the second conductive layer.