The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Nov. 11, 2011
Paeivi Lehtonen, Fellbach, DE;
Thomas Kaden, Schwieberdingen, DE;
Denis Gugel, Gerlingen, DE;
Thomas Suenner, Stuttgart, DE;
Tim Behrens, Tuebingen, DE;
Paeivi Lehtonen, Fellbach, DE;
Thomas Kaden, Schwieberdingen, DE;
Denis Gugel, Gerlingen, DE;
Thomas Suenner, Stuttgart, DE;
Tim Behrens, Tuebingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
An electronic assembly includes a leadframe (), a semiconductor component (), and an electrically conductive connecting element () made of a composite material (). The connecting element () has a solderable metallization () on the composite material () on a surface that is directed towards the semiconductor component (). A thermal conductivity of the composite material () of the connecting element () is greater than a thermal conductivity of the semiconductor component () and less than a thermal conductivity of the leadframe (). The connecting element () is provided only locally in the region of the semiconductor component ().