The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
May. 31, 2013
Applicants:
Makoto Imai, Toyota, JP;
Atsushi Tanida, Nisshin, JP;
Takashi Asada, Nisshin, JP;
Masanori Usui, Seto, JP;
Tomoyuki Shoji, Nisshin, JP;
Inventors:
Makoto Imai, Toyota, JP;
Atsushi Tanida, Nisshin, JP;
Takashi Asada, Nisshin, JP;
Masanori Usui, Seto, JP;
Tomoyuki Shoji, Nisshin, JP;
Assignee:
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/495 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/492 (2013.01); H01L 24/33 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor element side and a second face at the plate electrode side, and a ceramic portion surrounding the metal portion. An area of the first face is less than an area of the second face in the metal portion.