The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Mar. 14, 2013
Applicant:

Horiba, Ltd., Kyoto-shi, Kyoto, JP;

Inventor:

Tomoya Shimizu, Kyoto, JP;

Assignee:

HORIBA, Ltd., Kyoto-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 5/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 22/12 (2013.01);
Abstract

A sample is analyzed efficiently with combining a structural defect detection and a physical information measurement so as to determine whether a structural defect is the defect that degrades the device performance or not, not only by detecting the structural defect exists in the sample, but also by measuring a physical information that occurs due to the structural defect. It comprises a structural defect detection devicethat detect a structural defect KK of a sample W, a structural defect setting device that sets up the structural defect KK for which a physical information is to be measured based on the defect information among the structural defect KK detected by the structural defect detection device, and a physical information measurement devicethat measures the physical information of the defect region KR including the structural defect set up by the structural defect setting device.


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Shimizu, Tomoya. (2015). Sample analysis apparatus and sample analysis program (U.S. Patent No. 8933402). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8933402

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