The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Nov. 06, 2012
Applicant:

Seiko Instruments Inc., Chiba, JP;

Inventors:

Hitoshi Kamamori, Chiba, JP;

Sadao Oku, Chiba, JP;

Hiroyuki Fujita, Chiba, JP;

Koji Tsukagoshi, Chiba, JP;

Keiichiro Hayashi, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 1/42 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
G01J 1/42 (2013.01); H01L 31/0203 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/45147 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (), a glass substrate () with a cavity having divided and exposed through-hole electrodes () on the periphery thereof, and an optical sensor element () mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.


Find Patent Forward Citations

Loading…