The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Feb. 08, 2012
Applicants:

Motoki Kakui, Yokohama, JP;

Hiroshi Kohda, Yokohama, JP;

Yasuomi Kaneuchi, Yokohama, JP;

Shinobu Tamaoki, Yokohama, JP;

Shigehiro Nagano, Yokohama, JP;

Yoshiyuki Uno, Okayama, JP;

Yasuhiro Okamoto, Okayama, JP;

Kenta Takahashi, Okayama, JP;

Inventors:

Motoki Kakui, Yokohama, JP;

Hiroshi Kohda, Yokohama, JP;

Yasuomi Kaneuchi, Yokohama, JP;

Shinobu Tamaoki, Yokohama, JP;

Shigehiro Nagano, Yokohama, JP;

Yoshiyuki Uno, Okayama, JP;

Yasuhiro Okamoto, Okayama, JP;

Kenta Takahashi, Okayama, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/36 (2014.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); B23K 26/10 (2006.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0042 (2013.01); B23K 26/36 (2013.01); B23K 26/365 (2013.01); B23K 26/367 (2013.01); H01L 21/302 (2013.01); B23K 26/0063 (2013.01); B23K 26/0869 (2013.01); B23K 26/10 (2013.01); B23K 26/38 (2013.01); B23K 26/4075 (2013.01);
Abstract

There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.


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