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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8933343 B1

PDFFull Text
Date of Patent:
Jan. 13, 2015

Filed:

Mar. 04, 2013

Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes

Applicant:

Inpaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Ming-Fung Hsieh, Changhua County, TW;

Yu-Chia Chang, Taichung, TW;

Chun-Pin Huang, Hsinchu, TW;

Yung-Chang Peng, Miaoli County, TW;

Assignee:

Inpaq Technology Co., Ltd., Miaoli County, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Sherman Ng

Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 7/00 (2006.01); H01L 29/40 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01);
Abstract

An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

Find Patent Forward Citations

Hsieh, Ming-Fung. (2015). Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes (U.S. Patent No. 8933343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8933343

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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