The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Sep. 21, 2012
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, Aichi-ken, JP;

Inventors:

Kenji Suzuki, Ichinomiya, JP;

Masanori Kito, Iwakura, JP;

Yuma Otsuka, Komaki, JP;

Hisayoshi Kamiya, Nagoya, JP;

Tsuyoshi Tanabashi, Mizuho, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0246 (2013.01); H05K 3/242 (2013.01); H05K 1/0251 (2013.01); H05K 1/0306 (2013.01); H05K 1/167 (2013.01); H05K 2201/0317 (2013.01);
Abstract

A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers.


Find Patent Forward Citations

Suzuki, Kenji. (2015). Wiring substrate and method of manufacturing the same (U.S. Patent No. 8933342). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8933342

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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