The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Mar. 16, 2012
Takahiro Takano, Hiratsuka, JP;
Takahiko Sumino, Hiratsuka, JP;
Kentarou Ishihara, Hiratsuka, JP;
Bernardus Antonius Gerardus Schrauwen, Leende, NL;
Takahiro Takano, Hiratsuka, JP;
Takahiko Sumino, Hiratsuka, JP;
Kentarou Ishihara, Hiratsuka, JP;
Bernardus Antonius Gerardus Schrauwen, Leende, NL;
Mitsubishi Chemical Europe GmbH, Duesseldorf, DE;
Mitsubishi Engineering-Plastics Corporation, Tokyo, JP;
Abstract
Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.