The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Nov. 27, 2006
Applicant:
Hiroo Kamikawa, Uji, JP;
Inventor:
Hiroo Kamikawa, Uji, JP;
Assignee:
Unitika Ltd., Hyogo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60C 1/00 (2006.01); C08G 73/10 (2006.01); C08L 67/03 (2006.01); C08L 69/00 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C08L 67/03 (2013.01); C08L 69/00 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01);
Abstract
A resin composition is provided, which comprises: 40 to 95% by mass of a resin component containing 10 to 100% by mass of a polyarylate resin and 90 to 0% by mass of a polycarbonate resin; and 60 to 5% by mass of spherical silica having an average particle diameter of not greater than 10 μm. The resin composition is molded into a product.
Quick Actions:
Kamikawa, Hiroo. (2015). Resin composition and product molded from the same (U.S. Patent No. 8933160). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8933160
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile