The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Apr. 07, 2011
Applicants:

Katsushi Takano, Tokyo, JP;

Hiroaki Izumi, Tokyo, JP;

Kanji Sugino, Tokyo, JP;

Inventors:

Katsushi Takano, Tokyo, JP;

Hiroaki Izumi, Tokyo, JP;

Kanji Sugino, Tokyo, JP;

Assignee:

PS4 Luxco S.a.r.l., Luxembourg, LU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G05B 19/12 (2006.01);
U.S. Cl.
CPC ...
G05B 19/128 (2013.01); G05B 2219/32055 (2013.01); G05B 2219/32067 (2013.01); G05B 2219/32127 (2013.01); G05B 2219/45031 (2013.01);
Abstract

A method of manufacturing a semiconductor device may include, but is not limited to the following processes. A first group identifier allocated to a first group of semiconductor wafers is detected. The first group of semiconductor wafers includes a first semiconductor wafer to be processed first among the first group. A first processor of a plurality of processors, which process respective ones of the first group of semiconductor wafers, are determined based on the first group identifier. The first processor is used for processing the first semiconductor wafer. The first semiconductor wafer is supplied to the first processor.


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