The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Jan. 16, 2009
Applicants:
Meng-yen Chou, Kaohsiung, TW;
Chuan Zong Lee, Kaohsiung, TW;
Inventors:
Meng-Yen Chou, Kaohsiung, TW;
Chuan Zong Lee, Kaohsiung, TW;
Assignee:
Eternal Chemical Co., Ltd., Taiwan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); C08F 283/04 (2006.01); C08G 18/60 (2006.01); C08G 73/12 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C08G 73/126 (2013.01); C08G 73/1042 (2013.01); C08G 73/12 (2013.01); C08G 73/123 (2013.01); C08G 73/124 (2013.01); C08G 73/127 (2013.01); C08L 79/085 (2013.01); G03F 7/0387 (2013.01); H05K 3/287 (2013.01); Y10S 430/107 (2013.01);
Abstract
The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.