The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Dec. 23, 2009
Applicants:

Chung-kun Cho, Suwon-si, KR;

Myung-sup Jung, Seongnam-si, KR;

Kwang-hee Kim, Seoul, KR;

Jae-jun Lee, Suwon-si, KR;

Kalinina Fedosya, Ulan-Ude, RU;

Mahn Jong Kim, Yuseong-gu, JP;

Chung Won Park, Yuseong-gu, KR;

Inventors:

Chung-Kun Cho, Suwon-si, KR;

Myung-Sup Jung, Seongnam-si, KR;

Kwang-Hee Kim, Seoul, KR;

Jae-Jun Lee, Suwon-si, KR;

Kalinina Fedosya, Ulan-Ude, RU;

Mahn Jong Kim, Yuseong-gu, JP;

Chung Won Park, Yuseong-gu, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 15/08 (2006.01); C08K 7/22 (2006.01); C08K 7/24 (2006.01); C08K 7/26 (2006.01); H05K 1/03 (2006.01); C08K 7/28 (2006.01); C08K 5/1515 (2006.01); C08K 5/3415 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08K 7/28 (2013.01); C08K 5/1515 (2013.01); C08K 5/3415 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0254 (2013.01);
Abstract

Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L, L, Zand Zare the same as in defined in the specification.


Find Patent Forward Citations

Loading…