The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Apr. 07, 2010
Naoki Toda, Nagoya, JP;
Satoshi Imaeda, Nagoya, JP;
Takeshi Yamaguchi, Nagoya, JP;
Toshihiko Kariya, Nagoya, JP;
Naoki Toda, Nagoya, JP;
Satoshi Imaeda, Nagoya, JP;
Takeshi Yamaguchi, Nagoya, JP;
Toshihiko Kariya, Nagoya, JP;
Mitsubishi Heavy Industries Plastic Technology, Nagoya-shi, JP;
Abstract
The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.