The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Nov. 18, 2013
Jtekt Corporation, Osaka-shi, JP;
Hiroshi Ueno, Tondabayashi, JP;
Kazuki Hamada, Kashiwara, JP;
Jtekt Corporation, Osaka-shi, JP;
Abstract
An inner die of a molding die includes a core shaft, split dies radially arranged along an outer peripheral surface of the core shaft around an axis of the core shaft, which serves as a center, and a cylindrical set ring arranged below the split dies, the core shaft being inserted through the set ring. An annular engaging surface, which is a tapered surface whose diameter is gradually reduced downward, is formed in an inner peripheral side of an upper end portion of the set ring, and lower end portions of the respective split dies are introduced into, and engaged with the engaging surface. The molding die includes a pressing portion that presses downward upper end portions of the respective split dies introduced into the set ring, so as to move the lower end portions of the respective split dies toward the axis along the engaging surface.