The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Mar. 16, 2011
Jens Goedecke, Stuttgart, DE;
Karl-heinz Ilzhoefer, Kirchheim, DE;
Jens Goedecke, Stuttgart, DE;
Karl-Heinz Ilzhoefer, Kirchheim, DE;
Daimler AG, Stuttgart, DE;
Abstract
Method for producing an SMC multi-layer component in a production process. The component has a sandwich structure. At least one foam material layer () is embedded between two SMC cover layers (). An insert layer arrangement comprising at least one first and one second SMC semifinished product cover layer () is positioned in a press mold comprising a punch () and a die (). A first and a second SMC semifinished product cover layers () are shaped into two SMC cover layers () by applying pressure to the layer arrangement. Curing of the first and the second SMC semifinished product cover layers () is initiated. The punch () and the die () are moved away from each other, until the distance provided therebetween corresponds to a thickness of the SMC multi-layer component to be produced. A foaming process of a material () that can be foamed, which is provided between the two SMC cover layers () is initiated, producing the foam material layer (). After the foaming has ended, the SMC multi-layer component is removed from the press mold.