The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Nov. 12, 2008
Sergei Stefanidin, Winnipeg, CA;
Boris Shamshidov, Or Akiva, IL;
Shai Aviezer, Moshav Shilat, IL;
Rina Mandel, Netanya, IL;
Kostia Mandel, Netanya, IL;
Sergei Stefanidin, Winnipeg, CA;
Boris Shamshidov, Or Akiva, IL;
Shai Aviezer, Moshav Shilat, IL;
Other;
Abstract
A workpiece having a multiple-phase working surface, and a lapping process for producing the surface, the process including: (a) providing a system including: (i) a workpiece having a multiple-phase working surface having a first continuous solid phase, and a second solid phase, intimately dispersed within the continuous phase in the multiple-phase working surface, the continuous phase having a hardness exceeding a hardness of the second phase by a Mohs Hardness of at least 0.5; (ii) a contact surface, disposed generally opposite the working surface, having a Shore D hardness within a range of 40-90, and a Young's modulus of less than 20 gigapascals; (iii) a plurality of abrasive particles, freely disposed between the contact and working surfaces, and (b) lapping the working surface by exerting a pressure on the surfaces and applying a relative motion between the surfaces, to effect an elastic interaction between the contact surface and the abrasive particles in which at least a portion of the abrasive particles penetrate the working surface, to produce a lapped product having a modified working surface, in which an exterior surface of the second phase is recessed by an average of at least 1.5 micrometers with respect to an exterior surface of the continuous phase.