The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Jun. 25, 2012
Applicant:
Chu-keng Lin, Miao-Li, TW;
Inventor:
Chu-Keng Lin, Miao-Li, TW;
Assignee:
ScienBiziP Consulting (Shenzhen) Co., Ltd., Guangdong, CN;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 5/00 (2006.01); F21V 29/00 (2006.01); F21K 99/00 (2010.01); F21V 5/04 (2006.01); F21V 31/00 (2006.01); F21S 8/04 (2006.01); F21V 23/06 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
F21V 29/225 (2013.01); F21V 29/2293 (2013.01); F21K 9/00 (2013.01); F21V 5/04 (2013.01); F21V 31/00 (2013.01); F21S 8/043 (2013.01); F21V 5/007 (2013.01); F21V 23/06 (2013.01); F21Y 2101/02 (2013.01);
Abstract
An LED lamp includes a heat sink, a lamp shell and a light module. The heat sink includes a substrate and a plurality of fins. The substrate has a top surface and a bottom surface. The lamp shell is fixed to a periphery of the substrate. The light module is received between the lamp shell and the bottom surface of the substrate of the heat sink. The substrate defines a first through-hole through the top and bottom surfaces thereof to communicate airflow channels between the fins with a space below the bottom surface of the substrate, wherein the light module is received in the space.