The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Mar. 07, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dong-jae Shin, Seoul, KR;
Hyun-il Byun, Seongnam-si, KR;
Kwang-hyun Lee, Hwaseong-si, KR;
Kwan-sik Cho, Hwaseong-si, KR;
Ho-chul Ji, Yongin-si, KR;
Jung-hyung Pyo, Seoul, KR;
Kyoung-ho Ha, Seoul, KR;
Abstract
A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection.