The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Mar. 10, 2011
Shigeru Asami, Tokyo, JP;
Seiichi Tajima, Tokyo, JP;
Hiroki Hara, Tokyo, JP;
Shuichi Takizawa, Tokyo, JP;
Masumi Kameda, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Shigeru Asami, Tokyo, JP;
Seiichi Tajima, Tokyo, JP;
Hiroki Hara, Tokyo, JP;
Shuichi Takizawa, Tokyo, JP;
Masumi Kameda, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.