The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Nov. 14, 2012
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Koichi Shimizu, Fujisawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H04N 5/232 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 27/14618 (2013.01); H01L 2924/3511 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/97 (2013.01); H01L 31/02016 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H04N 5/23229 (2013.01); H01L 2224/8592 (2013.01); H01L 24/97 (2013.01);
Abstract

A solid state apparatus comprising, a printed circuit board having a first and a second surface that are opposite surfaces, a semiconductor chip for imaging arranged on the first surface, a sealing resin arranged to cover the printed circuit board and the semiconductor chip, and a translucent member arranged on the sealing resin, the solid state apparatus having a first region located inward of an outer edge of the semiconductor chip, and a second region located outward of the outer edge, the printed circuit board comprising, on the first surface, a first terminal electrically connected to the semiconductor chip, and comprising, on the second surface, a second terminal electrically connected to the first terminal within the printed circuit board, the second terminal being arranged in the first region.


Find Patent Forward Citations

Loading…