The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

May. 28, 2009
Applicants:

Arturo Silva, Allen, TX (US);

Neil Gayle, Austin, TX (US);

Inventors:

Arturo Silva, Allen, TX (US);

Neil Gayle, Austin, TX (US);

Assignee:

Flextronics AP, LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 3/14 (2006.01); H01F 3/10 (2006.01); H01F 27/34 (2006.01); H01F 37/00 (2006.01); H01F 17/00 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01F 3/14 (2013.01); H01F 3/10 (2013.01); H01F 27/346 (2013.01); H01F 37/00 (2013.01); H01F 2017/0093 (2013.01); H05K 1/165 (2013.01);
Abstract

An inductive element including a magnetic core with a section received in a central opening defined in each of the layers in a multilayer circuit board. A primary winding, an auxiliary winding, and a secondary winding are each realized in conductive coils located on a plurality of layers in the circuit board. The secondary winding is separated from the other windings by a relatively-thick dielectric layer. Other dielectric layers separate each of the layers with the coils. EMI shields are provided on other layers. The coils are located in a central region of each layer so as to provide an adequate safety margin from the side edges of the inductive element.


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