The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Feb. 13, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Herschel A. Ainspan, New Hempstead, NY (US);

Anthony R. Bonaccio, Shelburne, VT (US);

Ramana M. Malladi, Williston, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/08 (2006.01); G05F 3/02 (2006.01);
U.S. Cl.
CPC ...
G05F 3/02 (2013.01);
Abstract

Systems and methods for reducing process sensitivity in integrated circuit ('IC') fabrication. An integrated circuit structure is provided that includes a first integrated circuit device having at least one parameter influenced by process variation in a first manner. The integrated circuit structure further includes a second integrated device having the least one parameter influenced by the process variation in a second manner. The first manner is opposite of the second manner. The second integrated device is configured to offset or reduce the influence of the process variation on the at least one parameter in the first integrated circuit device.


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