The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
May. 23, 2012
Applicants:
Seung Han, Uiwang-si, KR;
Ju MI Kim, Uiwang-si, KR;
Sung Su Park, Uiwang-si, KR;
Eun Jung Lee, Uiwang-si, KR;
Inventors:
Seung Han, Uiwang-si, KR;
Ju Mi Kim, Uiwang-si, KR;
Sung Su Park, Uiwang-si, KR;
Eun Jung Lee, Uiwang-si, KR;
Assignee:
Cheil Industries Inc., Gumi-si, Kyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/04 (2006.01); C08G 59/32 (2006.01); C09D 163/04 (2006.01); C09J 163/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08G 59/3218 (2013.01); C09D 163/04 (2013.01); C09J 163/04 (2013.01); C08L 63/04 (2013.01);
Abstract
An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.