The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Mar. 10, 2009
Applicant:
Frank Kuo, Kaohsiung, TW;
Inventor:
Frank Kuo, Kaohsiung, TW;
Assignee:
Vishay-Siliconix, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 2924/0002 (2013.01); H01L 23/3107 (2013.01);
Abstract
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice () to die pads in cavities (--) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (-) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (--) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.