The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
May. 30, 2014
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Politecnico Di Milano, Milan, IT;
Gian Pietro Vanalli, Almenno San Bartolomeo, IT;
Giovanni Campardo, Bergamo, IT;
Aldo Losavio, Bergamo, IT;
Paolo Pulici, Legnano, IT;
Pier Paolo Stoppino, Milan, IT;
STMicroelectronics S.r.l., Agrate Brianza (MB), IT;
Politecnico di Milano, Milan, IT;
Abstract
A substrate has a first surface and a second surface opposed to each other. A blind hole is formed in the substrate extending from the first surface at a location for each through via. Each blind hole is filled with a conductive filler; a deepest part of each filler forming a bump portion made of a solder material. Part of the substrate extending from the second surface is removed to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding solder bump.