The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

May. 24, 2013
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventor:

Satoshi Hatsukawa, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 31/0256 (2006.01); H01L 27/02 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 27/0203 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 22/14 (2013.01); H01L 2224/49175 (2013.01);
Abstract

To provide a semiconductor device which allows a plurality of semiconductor chips to let a current flow uniformly therethrough and a method of manufacturing the same. The semiconductor device in accordance with one embodiment comprises a plurality of first semiconductor chips and a circuit board, mounted with the plurality of the first semiconductor chips, having first and second wiring conductors electrically connected to the plurality of first semiconductor chips. The plurality of first semiconductor chips are connected in parallel together with the first and second wiring conductors so as to construct a first parallel circuit. The plurality of first semiconductor chips are arranged on the circuit board according to an on-resistance of the plurality of first semiconductor chips so that a uniform current flows through the plurality of first semiconductor chips.


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