The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Feb. 20, 2009
Guangjun Zhang, Beijing, CN;
Yuanchun Xie, Beijing, CN;
Guangjun Zhang, Beijing, CN;
Yuanchun Xie, Beijing, CN;
Telefonaktiebolaget L M Ericsson (Publ), Stockholm, SE;
Abstract
A thermal pad () formed on a Printed Circuit Board and a method () of formed the thermal pad () are provided. The thermal pad () comprises in its interior one or more coins () has a height equal to a thickness of the PCB, and is made of metal or alloy, inserted into a corresponding one of one or more plated cutouts straight through the PCB in the thermal pad, and bonded to side walls of the corresponding one of the one or more plated cutouts with a paste capable of resisting a temperature of 250° C. or above. The plurality of through via () are plated, and lugged with a solder mask. The thermal pad () has a flat top surface and a flat bottom surface, either of which is coplanar with a corresponding one of top and bottom surfaces of the PCB. A PCB having formed thereon the above thermal pad () is also provided.