The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Nov. 12, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Uwe Hoeckele, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/26 (2006.01); H01L 21/42 (2006.01); H01L 21/768 (2006.01); H01L 45/00 (2006.01); H01L 21/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76886 (2013.01); H01L 45/149 (2013.01); H01L 21/0237 (2013.01); H01L 21/02527 (2013.01); H01L 21/02444 (2013.01); H01L 23/53276 (2013.01); H01L 21/76823 (2013.01); H01L 21/76838 (2013.01); H01L 21/76867 (2013.01); H01L 2221/1094 (2013.01); Y10S 977/81 (2013.01);
Abstract

A method can be used for locally rendering a carbonic isolating layer conductive. In one embodiment, a laser beam is directed onto the carbonic isolating layer so as to convert amorphous carbon of the carbonic isolating layer into graphite-like carbon. In another embodiment, the carbonic layer is heated so as to form a conducting portion of the layer so that a lateral path through the conducting portion connects two circuit elements of the integrated circuit.


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