The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Jan. 07, 2013
Applicant:

Pfc Device Corp., New Taipei, TW;

Inventors:

Kou-Liang Chao, New Taipei, TW;

Hung-Hsin Kuo, New Taipei, TW;

Tse-Chuan Su, New Taipei, TW;

Mei-Ling Chen, New Taipei, TW;

Assignee:

PFC Device Corp., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/44 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66143 (2013.01); H01L 29/0619 (2013.01); H01L 29/404 (2013.01); H01L 29/407 (2013.01); H01L 29/872 (2013.01); H01L 29/8725 (2013.01);
Abstract

A trench Schottky diode and its manufacturing method are provided. The trench Schottky diode includes a semiconductor substrate having therein a plurality of trenches, a gate oxide layer, a polysilicon structure, a guard ring and an electrode. At first, the trenches are formed in the semiconductor substrate by an etching step. Then, the gate oxide layer and the polysilicon structure are formed in the trenches and protrude above a surface of the semiconductor substrate. The guard ring is formed to cover a portion of the resultant structure. At last, the electrode is formed above the guard ring and the other portion not covered by the guard ring. The protruding gate oxide layer and the protruding polysilicon structure can avoid cracks occurring in the trench structure.


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