The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Oct. 12, 2009
Applicants:
Peter Goesele, Roehlingen, DE;
Friedrich Seger, Knittlingen, DE;
Josef Sinder, Ellwangen, DE;
Joachim Stifter, Muehlacker, DE;
Oliver Werner, Muehlacker, DE;
Inventors:
Peter Goesele, Roehlingen, DE;
Friedrich Seger, Knittlingen, DE;
Josef Sinder, Ellwangen, DE;
Joachim Stifter, Muehlacker, DE;
Oliver Werner, Muehlacker, DE;
Assignee:
Tyco Electronics AMP GmbH, Bensheim, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 23/49537 (2013.01); H01L 2924/0002 (2013.01);
Abstract
The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.