The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Jan. 28, 2014
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Masafumi Kuramoto, Tokushima, JP;

Satoru Ogawa, Anan, JP;

Miki Niwa, Anan, JP;

Assignee:

Nichia Corporation, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 21/18 (2006.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/81894 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/014 (2013.01); H01L 24/17 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01058 (2013.01); H01L 21/187 (2013.01); H01L 2924/01032 (2013.01); H01L 24/81 (2013.01); H01L 2924/0103 (2013.01); H01L 2224/13099 (2013.01); H01L 24/29 (2013.01); H01L 2924/01105 (2013.01); H01L 2924/01063 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01024 (2013.01); H01L 2224/8383 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/812 (2013.01); H01L 2224/29101 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/0104 (2013.01); H01L 2224/2908 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/3025 (2013.01); H01L 2224/29111 (2013.01); H01L 2924/01078 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/15787 (2013.01); H01L 2224/29 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01064 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2224/81907 (2013.01); H01L 33/62 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 24/83 (2013.01); H01L 2924/19041 (2013.01); H01L 2224/83801 (2013.01); H01L 24/32 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/3225 (2013.01);
Abstract

An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. A method for producing a semiconductor device in which silver or silver oxide provided on a surface of a base and silver or silver oxide provided on a surface of a semiconductor element are bonded, includes the steps of arranging a semiconductor element on a base such that silver or silver oxide provided on a surface of the semiconductor element is in contact with silver or silver oxide provided on a surface of the base, and bonding the semiconductor element and the base by applying heat having a temperature of 200 to 900° C. to the semiconductor device and the base.


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