The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Jun. 11, 2010
Applicants:
Chrystelle Lagahe Blanchard, Crolles, FR;
Marcel Broekaart, Theys, FR;
Arnaud Castex, Grenoble, FR;
Inventors:
Assignee:
Soitec, Bernin, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 31/02 (2006.01); B32B 37/10 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); H01L 21/76254 (2013.01); H01L 21/76251 (2013.01);
Abstract
A method of bonding by molecular bonding between at least one lower wafer and an upper wafer comprises positioning the upper wafer on the lower wafer. In accordance with the invention, a contact force is applied to a peripheral side of at least one of the two wafers in order to initiate a bonding wave between the two wafers.