The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Nov. 18, 2010
Applicants:

Manabu Yoshida, Tsukuba, JP;

Toshihide Kamata, Tsukuba, JP;

Inventors:

Manabu Yoshida, Tsukuba, JP;

Toshihide Kamata, Tsukuba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1283 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0271 (2013.01); H05K 2203/0278 (2013.01);
Abstract

Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a substrate () and a conductive pattern () provided on the substrate (), wherein the conductive pattern (), except on a surface and in a vicinity thereof on a side opposite to the substrate side, entirely has a structure comprising a binder () and fine aluminum grains () dispersed therein, and on the surface and in the vicinity a surface metal aluminum layer () is formed in which the fine aluminum grains () are spread with a roller to form a conductive junction connecting the fine aluminum grains to each other.


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