The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Mar. 30, 2012
Applicant:
Erich Thallner, St. Florian, AT;
Inventor:
Erich Thallner, St. Florian, AT;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H01L 21/71 (2006.01); H01L 21/67 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/71 (2013.01); H01L 21/67092 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/67 (2013.01);
Abstract
A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers (), wherein a bond pressure is applied in succession to partial sections of the joining surface V.