The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Sep. 02, 2011
Applicants:

Michael Schäfer, Künzell, DE;

Wolfgang Schmitt, Rodgau, DE;

Inventors:

Michael Schäfer, Künzell, DE;

Wolfgang Schmitt, Rodgau, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/22 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0062 (2013.01); B22F 1/007 (2013.01); B22F 1/0074 (2013.01); B22F 1/02 (2013.01); B22F 7/064 (2013.01); B22F 7/08 (2013.01); H01L 24/83 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/271 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/83469 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27505 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83464 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01076 (2013.01); H01L 2924/01078 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29424 (2013.01); H01L 2224/29469 (2013.01); H01L 2224/29464 (2013.01); H01L 2224/29295 (2013.01); H01L 2224/27442 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/05571 (2013.01); H01L 2924/07811 (2013.01);
Abstract

A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.


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