The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Jul. 27, 2011
Applicants:

Tadashi Endo, Yamanashi, JP;

Hiroshi Ogata, Yamanashi, JP;

Tomohiro Kimura, Yamanashi, JP;

Takaaki Yokoi, Yamanashi, JP;

Inventors:

Tadashi Endo, Yamanashi, JP;

Hiroshi Ogata, Yamanashi, JP;

Tomohiro Kimura, Yamanashi, JP;

Takaaki Yokoi, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0452 (2013.01); H05K 13/0413 (2013.01);
Abstract

It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.


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