The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Oct. 04, 2010
Applicants:
Tadashi Imai, Chiba, JP;
Takayuki Kaida, Tokyo, JP;
Hitoshi Masumura, Kanagawa, JP;
Inventors:
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 7/185 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H04N 5/50 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H04B 7/18517 (2013.01); H01L 23/552 (2013.01); H01L 23/645 (2013.01); H01L 25/16 (2013.01); H01L 2223/6677 (2013.01); H04N 5/50 (2013.01); H05K 9/006 (2013.01);
Abstract
There are provided a high frequency module and a receiver capable of exhausting an electric field and a magnetic field to the outside of a shield, more closely arranging electronic components inside the shield, and being downsized. The high frequency module has integrated circuits (IC)each incorporating an oscillator including an inductor, and a shield caseas a shield for covering the ICs, and the shield caseas a shield is formed with openingsA,B having a size equal to or more than half the shape size of the ICsin areas opposed to the arrangement positions of the ICs