The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Feb. 20, 2012
Applicants:

Rainer Dohle, Kesseldorf, DE;

Florian Schuessler, Erlangen, DE;

Rolf Diehm, Wertheim, DE;

Oliver Kessling, Landshut, DE;

Thomas Oppert, Berlin, DE;

Inventors:

Rainer Dohle, Kesseldorf, DE;

Florian Schuessler, Erlangen, DE;

Rolf Diehm, Wertheim, DE;

Oliver Kessling, Landshut, DE;

Thomas Oppert, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/28 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/563 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/14 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/014 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/81902 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/10135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/00013 (2013.01);
Abstract

An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.


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