The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Feb. 27, 2013
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Masaki Inui, Nagaokakyo, JP;
Hiromu Fukushima, Nagaokakyo, JP;
Assignee:
Murata Manufactring Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 7/06 (2006.01); H01F 17/00 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 41/0206 (2013.01); H01F 17/0033 (2013.01); H01F 41/046 (2013.01);
Abstract
A laminated electronic component includes a first magnetic material portion, a low-magnetic-permeability portion laminated on the first magnetic material portion, a second magnetic material portion laminated on the low-magnetic-permeability portion, at least one annular or spiral coil disposed within the low-magnetic-permeability portion, and a plurality of columnar magnetic material portions disposed within the low-magnetic-permeability portion so as to extend through inside of the coil and connecting the first magnetic material portion to the second magnetic material portion.