The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Dec. 26, 2013
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Kazuhiko Yamanaka, Osaka, JP;
Shinji Yoshida, Shiga, JP;
Shinichi Takigawa, Osaka, JP;
Takuma Katayama, Kyoto, JP;
Hideyuki Nakanishi, Osaka, JP;
Tsuyoshi Tanaka, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/50 (2006.01); H05B 33/04 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H05B 33/04 (2013.01); H01L 33/486 (2013.01); H01L 33/504 (2013.01); H01L 25/0753 (2013.01); H01L 33/502 (2013.01); H01L 33/58 (2013.01); H01L 2933/0033 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/45144 (2013.01);
Abstract
A light-emitting device includes: a package; a semiconductor light-emitting element mounted above the package; a cap component provided above the package; a sealing component which seals a space between the package and the cap component; and a phosphor containing resin including phosphor disposed in the sealed space.