The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Feb. 27, 2012
Applicants:
Eiji Toyoda, Ibaraki, JP;
Hiroshi Noro, Ibaraki, JP;
Inventors:
Eiji Toyoda, Ibaraki, JP;
Hiroshi Noro, Ibaraki, JP;
Assignee:
Nitto Denko Corporation, Ibaraki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 163/00 (2006.01); C08L 33/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08L 33/00 (2013.01);
Abstract
A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device () having connection electrodes (bumps) () and mounted on a wiring circuit board (). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×10to 5×10Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.