logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8922027 B1

PDFFull Text
Expired
Date of Patent:
Dec. 30, 2014

Filed:

Nov. 08, 2012

Electronic device having electrodes bonded with each other

Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Taiji Sakai, Yokohama, JP;

Nobuhiro Imaizumi, Atsugi, JP;

Assignee:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Attorney:

Kratz, Quintos & Hanson, LLP

Primary Examiner:

Matthew Reames

Assistant Examiner:

Dinlinh Nguyen

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 23/488 (2006.01); G21K 5/02 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81013 (2013.01); H01L 24/81 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/97 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/11845 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/13111 (2013.01); H01J 2224/81203 (2013.01); H01L 2224/1182 (2013.01); H01L 23/488 (2013.01); H01L 24/13 (2013.01); H01L 2224/818 (2013.01); H01L 2224/118 (2013.01); G21K 5/02 (2013.01); H01L 2224/81014 (2013.01); H01L 2224/8101 (2013.01); H01L 21/67144 (2013.01); H01L 2224/81193 (2013.01); H01L 21/67092 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/16501 (2013.01); H01L 24/11 (2013.01); H01L 2224/9211 (2013.01); H01L 24/16 (2013.01); H01L 2224/8102 (2013.01); H01L 21/67017 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/81986 (2013.01);
Abstract

According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Find Patent Forward Citations

Sakai, Taiji. (2014). Electronic device having electrodes bonded with each other (U.S. Patent No. 8922027). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8922027

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…