The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Aug. 25, 2011
Applicants:

Oliver Hellmund, Feldkirchen, DE;

Daniel Kraft, Klagenfurt-Viktring, AT;

Friedrich Kroener, Villach, AT;

Francisco Javier Santos Rodriguez, Villach, AT;

Carsten Von Koblinski, Villach, AT;

Inventors:

Oliver Hellmund, Feldkirchen, DE;

Daniel Kraft, Klagenfurt-Viktring, AT;

Friedrich Kroener, Villach, AT;

Francisco Javier Santos Rodriguez, Villach, AT;

Carsten Von Koblinski, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/49 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 29/4966 (2013.01);
Abstract

A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first electrically conducting material particles are applied to a carrier substrate and a second electrically conducting material is galvanically deposited on a surface of the first material particles in such a way that the second material mechanically and electrically bonds the plurality of first material particles to one another.


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