The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

May. 10, 2013
Applicant:

Panasonic Corporation, Kadoma-shi, Osaka, JP;

Inventors:

Takatoshi Osumi, Nara, JP;

Daisuke Sakurai, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/76885 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second electrode terminals on a circuit board. The joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode. The end face of the first projecting electrode is larger in area than the end face of the second projecting electrode, and at least a part of the second electrode terminals exposed from the circuit board has a larger area than the bottom of the second projecting electrode.


Find Patent Forward Citations

Osumi, Takatoshi. (2014). Mounting structure of electronic component with joining portions and method of manufacturing the same (U.S. Patent No. 8922011). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8922011

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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