The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Mar. 15, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jong-Yun Myung, Seoul, KR;
Yong-Hwan Kwon, Suwon-si, KR;
Jong-Bo Shim, Asan-si, KR;
Moon-Gi Cho, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 23/3128 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/13084 (2013.01); H01L 24/03 (2013.01); H01L 24/16 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/05572 (2013.01);
Abstract
A bump structure includes a first bump and a second bump. The first bump is disposed on a connection pad of a substrate. The first bump includes a lower portion having a first width, a middle portion having a second width smaller than the first width, and an upper portion having a third width greater than the second width. The second bump is disposed on the upper portion of the first bump.