The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Aug. 23, 2011
Applicants:

Yoshiaki Shimooka, Sagamihara, JP;

Yoshiaki Sugizaki, Fujisawa, JP;

Inventors:

Yoshiaki Shimooka, Sagamihara, JP;

Yoshiaki Sugizaki, Fujisawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 23/12 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00333 (2013.01); B81C 2203/0136 (2013.01); H01L 2924/0002 (2013.01); B81C 2203/0145 (2013.01); H01L 23/3171 (2013.01);
Abstract

According to one embodiment, an electrical component comprises a substrate, an element, a first layer, and a second layer. The element is formed on the substrate. The first layer forms a cavity accommodating the element on the substrate and includes through holes. The second layer is formed on the first layer and seals the through holes. The first layer includes the first film formed on the lower side and the second film which is formed on the first film and has a lower coefficient of thermal expansion than the first film.


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Shimooka, Yoshiaki. (2014). Electrical component and method of manufacturing the same (U.S. Patent No. 8921997). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8921997

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