The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Mar. 15, 2013
Applicant:
Microchip Technology Incorporated, Chandler, AZ (US);
Inventors:
Gregory Dix, Tempe, AZ (US);
Roger Melcher, Gilbert, AZ (US);
Assignee:
Microchip Technology Incorporated, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01);
Abstract
A semiconductor power chip, may have a semiconductor die having a power device fabricated on a substrate thereof, wherein the power device has at least one first contact element, a plurality of second contact elements and a plurality of third contact elements arranged on top of the semiconductor die; and an insulation layer disposed on top of the semiconductor die and being patterned to provide openings to access the plurality of second and third contact elements and the at least one first contact element.