The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Oct. 11, 2013
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Yujie Zhang, Pittsburgh, PA (US);

Andrew J. Doller, Sharpsburg, PA (US);

Thomas Buck, Pittsburgh, PA (US);

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); H01L 21/00 (2006.01); H04R 25/00 (2006.01); H02N 1/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 1/04 (2006.01); H01L 41/00 (2013.01);
U.S. Cl.
CPC ...
B81B 7/0054 (2013.01); B81C 1/00666 (2013.01); H04R 1/04 (2013.01); H01L 41/00 (2013.01);
Abstract

A MEMS microphone. The MEMS microphone includes a back plate, a membrane, a support structure, a substrate, and an overtravel stop. The membrane is coupled to the back plate. The support structure includes a support structure opening and a first side of the support structure is coupled to a second side of the back plate. The substrate includes a substrate opening and a first side of the substrate is coupled to a second side of the support structure. The overtravel stop limits a movement of the membrane away from the back plate and includes at least one of an overtravel stop structure coupled to the substrate, an overtravel stop structure formed as part of a carrier chip, and an overtravel stop structure formed as part of the support structure in the support structure opening.


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