The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Mar. 15, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jin-Bum Kim, Seoul, KR;

Suk-Hun Choi, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/12 (2006.01); H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1211 (2013.01); H01L 21/76 (2013.01);
Abstract

To fabricate a semiconductor device, a fin is formed to protrude from a substrate. The fin is extended in a first direction. A gate line is formed on the fin and the substrate. The gate line is extended in a second direction crossing the first direction. An amorphous material layer is conformally formed to cover the substrate, the fin, and the gate line. The amorphous material layer is partially removed, thereby forming a first remaining amorphous layer on side walls of the fin and a second remaining amorphous layer on side walls of the gate line. The first remaining amorphous layer and the second remaining amorphous layer are annealed and the first remaining amorphous material layer and the second remaining amorphous material layer are crystallized into a monocrystalline material layer and a polycrystalline material layer, respectively. The polycrystalline material layer is removed.


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